PCB Modelling, SI/PI & EMC Analysis
PRM.DEV models and analyses PCBs at the schematic and layout stages: signal integrity (SI), power integrity (PI), thermal behaviour, and EMC. This helps prevent hardware issues early, reduces redesign cycles, and improves product reliability throughout its lifecycle.
Our services
3D PCB modelling
We build 3D PCB models for enclosure fit checks and downstream analysis.
What it gives you:
What it gives you:
- Faster enclosure development with fewer reworks
- Early detection of size and mounting conflicts
- A ready 3D model for thermal and SI/PI analysis
Signal integrity (SI) analysis
For complex digital boards with high-speed interfaces, we perform SI analysis using IBIS models.
What we analyse:
Result: fewer reworks, stable high-speed interfaces, and more predictable behaviour.
What we analyse:
- Parasitic capacitance and inductance in traces
- Crosstalk and routing discontinuities
- Edge distortion and reflections at the schematic/layout stage
Result: fewer reworks, stable high-speed interfaces, and more predictable behaviour.
EMC analysis
We review PCB layout from the perspective of emission and immunity.
Why it matters:
Why it matters:
- Fewer “board → test → redesign” cycles
- Lower certification and production test costs
- Better EMC performance for complex multi-board and integrated systems
Thermal modelling
We use thermal analysis where current, losses, and operating conditions matter.
Typical use cases:
Typical use cases:
- High-current PCB sections
- Ventilation opening size and placement in the enclosure
- Heatsink and forced-air cooling selection
- Heat dissipation area and airflow requirements
- Lower overheating risk during long-term operation
- Higher device reliability
- Shorter development time and lower cost
Power integrity (PI) analysis
PI analysis helps design a stable power distribution network, especially for highly integrated, high-current devices.
Typical challenges:
Typical challenges:
- Tight voltage stability requirements of modern ICs
- Higher placement density and widespread BGA use
- Pressure to reduce layer count under high loads
Need PCB analysis or modelling?
Message us — we’ll recommend the right simulations, define the scope, and estimate the timeline and budget.
Message us — we’ll recommend the right simulations, define the scope, and estimate the timeline and budget.
Our offices
Moscow
Troparyovskaya St., 4, bld. 1, room 6A
Moscow 119602, Russian Federation
Moscow 119602, Russian Federation
Innopolis
Universitetskaya St., 7, room 7
420500, Innopolis, Republic of Tatarstan
420500, Innopolis, Republic of Tatarstan
Contact us to discuss your engineering challenges
We will offer you the best solution!
All information provided will remain confidential!
All information provided will remain confidential!
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