High-Speed PCB Design
PRM.DEV designs and supports the production of high-speed PCBs, where signal quality and power stability are critical. We handle multilayer mixed-signal boards end to end — from block diagram and requirements to documentation, manufacturing prep, and production launch support.
Beyond layout, we run simulation and analysis: pre- and post-layout SI, PI, thermal analysis, and EMC/EMI checks. This reduces rework risk, speeds up the delivery of first working samples, and improves system reliability.
Beyond layout, we run simulation and analysis: pre- and post-layout SI, PI, thermal analysis, and EMC/EMI checks. This reduces rework risk, speeds up the delivery of first working samples, and improves system reliability.
Design flow
Every project is unique, but a typical workflow includes:
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Block diagram - Board technical requirements
- Library and footprint review
- Schematic design
- Component placement
- Layer stackup definition
- Pre-layout analysis
- PCB routing
- Layout review
- Post-layout analysis
- Schematic review by firmware engineer
- Documentation package preparation
Deliverables and documentation
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For PCB fabrication
- Gerber and NC Drill
- ODB++ if required
- IPC-D-356 for electrical testing
- Drill drawing in PDF
For assembly- BOM
- Solder paste stencil apertures
- Pick-and-place file
- Top/bottom assembly drawing
- Schematic files
Interfaces we work with- PCIe, 10GbE, 100GbE, Camera Link, MIPI, HDMI, DisplayPort, DDR4, JESD204B
Simulation and analysis
For digital boards with high-speed interfaces, we use IBIS-based SI analysis. We run it at the schematic stage and during routing to identify parasitic capacitance/inductance, crosstalk, and mismatches. We also verify timing behaviour: reflections, cross-coupling, and other signal-quality effects.
We analyse thermal behaviour across the board: temperature fields and gradients, heat distribution, and hotspots. This helps prevent overheating during long-term operation, improves reliability, reduces development time and costs, and lowers warranty service costs.We review PCB topology from an electromagnetic compatibility perspective. This reduces iteration count and certification time and improves immunity in complex integrated devices.PI analysis validates power distribution in highly integrated and high-current designs. We use DC drop, decoupling analysis, power-plane noise analysis, and related methods. The result is earlier issue detection, fewer prototype spins, and more reliable hardware.Need a high-speed PCB for your interface, power, thermal, or EMC constraints? Message us — we’ll propose the right approach.Our officesMoscowTroparyovskaya St., 4, bld. 1, room 6A
Moscow 119602, Russian FederationInnopolisUniversitetskaya St., 7, room 7
420500, Innopolis, Republic of TatarstanContact us to discuss your engineering challengesWe will offer you the best solution!
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